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X-ray inspection

X-ray inspection is a highly accurate analytical method that can be used for non-destructive inspection (NDT) of electronics.

HYTEK uses a real-time high-resolution (0.3µm spot) X-ray equipment with a digital detector that gives precise and sharp images and reveals even small details.


X-ray can, for example, be used for examination and analysis of:

  • Components
    • Assembly quality of components e.g. batteries, semiconductors (IC etc.)
    • Detection of internal defects in components
    • Detection of foreign objects (FOD) in components

  • Printed circuit boards (PCB)
    • Assembly quality on PCB e.g. soldering defects
    • Internal/hidden PCB defects e.g. annular ring break-out, missing plating, short circuits 
    • Detection of foreign objects (FOD) on and in laminate

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