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Implementation of BGA and Flip Chip components

Many companies today work with BGA, Flip Chip or similar component housings, because the technology can help to improve PCB space utilization. Other companies are uncertain about the first steps, e.g. because the hidden solder connections on these component types make visual inspection difficult.

On this course, the participants gain useful knowledge about this technique, so that they can introduce the technology in their productions.

  • The course will, among other subjects, be focusing on these main topics:
  • Chip technologies such as BGA, µBGA, CSP, Flip Chip and Bare Dies
  • Handling, including storage, ESD and moisture sensitivity
  • PCB laminates (CTE and Tg)
  • PCB structure, vias and error types
  • Solder paste application and assembly
  • Reflow soldering and test/control
  • Soldering and de-soldering
  • Cleaning
  • Component failure
  • Material and process defects
  • Quality requirements for suppliers
  • Quality requirements according to IPC and other applicable standards

The course is aimed at employees in the engineering, design and production departments.


DKK 3,900.00

Der er p.t. ingen tilgængelige datoer for dette kursus.

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