As a partof their green transition, many companies are looking at implementing aselective soldering process as an alternative to the standard wave solderingprocess.

This course will cover the issues related to the implementation of a selective solderingprocess.

To achievea low failure rate, process control and optimization are key elements.

Both atheoretical and a practical approach will used on the course when working with topics like process control and controlling critical process parameters e.g.temperature profiles.

Some of the topics covered during the course:

• Why selective soldering?
• Principles for selective processes
• Types of equipment
• Advantages / Disadvantages / Challenges
• Flux
• Flux types in general – IPC J-STD-004
• Choice of flux
• Flux application
• Drop Jet
• Brush / dip fluxing
• Solder
• Types in general – IPC J-STD-006
• Solder analysis
• Copper dissolution from PCBs
• PCB
• CTE and Tg
• Solderability – IPC J-STD-003
• Components
• Component qualification for selective sodering process
• PSL – IPC J-STD-075
• Solderability – IPC J-STD-002
• Temperature profile
• Components (PSL)
• Thermal issues in relation to the PCB
• Placement and attachment of sensors
• Process parameters in the selective process
• Transport systems
• Preheat
• Solder temperature
• Pump systems
• Contact time
• Nitrogen and consumption
• Nozzles
• Dynamic nozzles
• Productdedicated nozzles
• Wettable and nonwettable types
• PCB design
• HMT / Thermal design
• Design for selective soldering process
• Cleanliness
• Cleanliness requirements e.g. J-STD-001
• Cleanliness testing
• SIR-test
• Process control i.a.w. J-STD-001
• Failure analysis and corrective actions

The courseis aimed at employees in production, technical departments and designers – all having a basic understanding (Basic Wave Soldering), and requiring more specific competences within the selective soldering process.