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SMT process control   ■   Last modified: 25 - 04 - 2013

SMT process control

NB! IPC J-STD-001 is implemented in this course

A broad examination of the processes of SMD production can give the staff that is not directly involved in the techniques behind the processes a better insight and understanding.

During the course there will be practical end theoretical exercises which focus on the context of the production and the possibilities of optimizing the individual soldering and assembly processes. In addition, the lead-free processes are an integrated part of the course.


Among other things, the following is focused on:

  • PCB - design - lead-free/leaded
  • Knowledge of components
  • Types of solder paste - lead-free/leaded
  • Solder paste printing and dispensing technology
  • Types of adhesives
  • Adhesive dispensing and printing technology
  • Reflow soldering - lead-free/leaded
  • Wave soldering - lead-free/leaded
  • Methods for inspection and requirements for quality according to IPC and other specifications
The course is designed for new employees, management, buyers and employees in the production, production technical department, department for development etc.


                    


Price per participant: DKK 5.950 including course materials, refreshments and lunch.

Please contact HYTEK for course dates
 
HYTEK®   ■   Sofievej 61   ■   DK-9000 Aalborg   ■   Telephone no.: +45 9811 7003   ■   Fax: +45 9633 2201   ■   hytek@hytekaalborg.dk