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Mest anvendte IPC-standarder   ■   Sidst opdateret:    ■   Tænk stort - tænk HYTEK

Mest anvendte IPC-standarder

IPC-2220 Series

IPC-6010 Series

Assembly krav




IPC-2220 Series – Family of Design Documents
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Put IPC's design library at your fingertips! The series is built around the IPC-2221
(se indholdsfortegnelse her), Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer chooses the appropriate sectional standard for a specific technology.

All five sectional standards are included with the series:
IPC-2221, Generic Standard on Printed Board Design (se indholdsfortegnelse her)
- IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards
(se indholdsfortegnelse her)
- IPC-2223, Sectional Design Standard for Flexible Printed Boards
(se indholdsfortegnelse her)
- IPC-2225, Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies (se indholdsfortegnelse her)
- IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Printed Boards (se indholdsfortegnelse her)

This series provides coverage on material and final finish selection, current carrying capacity and minimum electrical clearances, test specimen design, guidelines for V-groove scoring, dimensioning requirements and conductor thickness requirements.

Ved køb af hele serien kan spares 20% fremfor køb af hver enkelt standard separat.

IPC-7351 – Generic Requirements for Surface Mount Design and Land Pattern Standard
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IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately.The tool also allows for modification of dimensional attributes of IPC approved land patterns.

This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.

Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SODFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.

Purchasers also receive a 10-day trial of the IPC-7351 Land Pattern Wizard developed by Mentor Graphics, which is an advanced version of the IPC-7351B Land Pattern Calculator. The IPC-7351B Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon and P-CAD. 102 pages. Released June 2010.

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Establishes the general requirements for documentation necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage. Includes master drawing requirements, board definition and artwork/phototooling. 94 pages. Revised May 1995.

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IPC-D-620 provides design and critical process requirements for the three product classes of cable and wire harness assemblies as well as military/space applications. It is the design requirements companion to IPC/WHMA-A-620, "Requirements and Acceptance for Cable and Wire Harness Assemblies," and its associated Space Addendum. 
Three white papers are included to provide guidance on key topics discussed in the Standard. These are:
- IPC-WP-113, Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP)
- IPC-WP-114, Guidance for the Development and Implementation of a White Plague Control Plan (WPCP)
- IPC-WP-116, Guidance for the Development and Implementation of a Foreign Object Debris (FOD)


IPC-6010 – Family of Board Performance Documents

The IPC-6010 series includes IPC's current qualification and performance specification standards for all major types of printed boards. The series includes:

- IPC-6011, the base document, which includes all generic requirements for printed boards, regardless of substrate (
se indholdsfortegnelse her). The IPC-6011 is supplemented by the appropriate sectional performance specification:
- IPC-6012, Qualification and Performance Specification for Rigid Printed Boards
(se indholdsfortegnelse her);
- IPC-6013, Qualification and Performance Specification for Flexible Printed Boards 
(se indholdsfortegnelse her);
- IPC-6015, Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
(se indholdsfortegnelse her);
- IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
(se indholdsfortegnelse her); and
- IPC-6018, Microwave End Product Board Inspection and Test. The specifications provide surface plating/coating criteria, hole plating integrity requirements, solder mask and covercoat coverage requirements, and quality assurance provisions that include test sample frequencies and lot inspection
(se indholdsfortegnelse her).

køb af hele serien kan spares 20% fremfor køb af hver enkelt standard separat.

IPC-A-600 - Acceptability of Printed Boards
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The definitive illustrated guide to printed circuit board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With over 90 new or revised photographs and illustrations, revision H provides new coverage on topics such as copper wrap plating, copper cap plating of filled holes, and hole wall/barrel separation along with updated and expanded coverage for measling of printed boards, delamination and haloing, laminate voids/cracks, etchback, blind and buried via fill, and flexible circuits. The document sychronizes to the acceptability requirements expressed in IPC-6012C and IPC-6013B. 157 pages. Released April 2010.

IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards
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This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 64 individual specification sheets that can be searched using keywords. These keywords allow the document's user to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. The D revision includes six new specification sheets which reflect the expanded offerings for current commercially available laminates and prepregs with improved or additional properties that are one or more of the following: low-halogen content, high-thermal performance, high speed/high frequency performance or thermally conductivity. Additionally, to keep this revision D current with the global industry, eight specification sheets in the prior revision were removed as they are no longer utilized nor manufactured. 158 pages. Released April 2014.

IPC-4553 - Specification for Immersion Silver Plating for Printed Boards
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This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface finish, applicable to soldering. It may also be applicable for some press fit connections and as a contact surface. It has the potential to be suitable for aluminum wire bonding. The immersion silver protects the underlying copper from oxidation over its intended shelf life. Exposure to moisture and air contaminants, such as sulfur and chlorine, may negatively impact the useful life of the deposit. The impact can range from a slight discoloration of the deposit to the pads turning completely black. Proper packaging is a requirement. Note that, in this revision, both a single thickness range is in place and an upper limit for immersion silver thickness has been established. 36 pages. Released May 2009.

IPC-4554 - Specification for Immersion Tin Plating for Printed Circuit Boards - includes Amendment 1
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IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards, is included in the IPC-455X series of specifications that set the requirements for printed board surface finishes that are alternates to non-coplanar finishes, most often referred to as tin-lead HASL finish. This specification is a full-color document that is intended for use by the supplier or printed board fabricator, plating chemistry supplier, contract assembler or EMS facility and the original equipment manufacturer (OEM). The immersion tin (Sn) is a metallic finish deposited by a chemical displacement reaction that is applied directly to the basis metal of the printed board, which is copper. The immersion tin is primarily used as a solderable surface for attachment of components. It may also be used when press fit connections are employed and for zero insertion force (ZIF) edge connectors. The immersion tin finish protects the underlying copper from oxidation over the intended shelf life of this finish that is described in IPC/EIA J-STD-003 as a Category 3 coating durability finish (storage of greater than six months). The inserted Amendment 1 provides more detail on the solderability of the immersion tin, using both tin-lead as well as "lead-free" solders using appropriate fluxes. 48 pages. Released with Amendment 1: January 2012.

IPC J-STD-003 - Solderability Tests for Printed Boards
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J-STD-003C prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin-lead or lead-free solders. This standard is intended for use by both vendor and user. The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes. This standard describes test methods by which both the surface conductors (and attachment lands) and plated-through holes may be evaluated for solderability. Revision "C" contains the latest information about GR&R (gauge reproducibility & repeatability) of the solderability tests as well as updated illustrations.

Amendment 1 corrects editorial errors as well as adds clarifying statements to many areas of the document. Released 2014, 27 pages.

IPC-1601 - Printed Board Handling and Storage Guidelines
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The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, establishing recommended moisture levels, establishing baking profiles for moisture removal and the impact of baking on printed board solderability.
18 pages. Released August 2010.

Assembly krav

IPC J-STD-001 - Requirements to Electrical and Electronic Assemblies
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IPC J-STD-001F er anerkendt verden over som den eneste industristandard, der dækker både loddematerialer og processer. Denne revision understøtter både traditionelle loddemetaller og blyfri produktion. Eksempler på nogle af de væsentligste ændringer er revision af kravene til pletterede huller, PTH, krav til minimum loddefyldning, kriterier for 2 nye SMT termineringstyper, og udvidede kriterier for conformal coating. Hvor det har været muligt er beskrivelserne af kriterierne blevet justeret for at gøre dem mere forståelige i forbindelse med materialer, metoder og verificering for at kunne producere kvalitetslodninger og produkter. Kravene omfatter konstruktioner i alle tre klasser. Farveillustrationer for at tydeliggøre. Denne standard supplerer IPC-A-610F og understøttes af IPC-HDBK-001. 70 sider. Udgivet juli 2014. Oversat februar 2015.

IPC J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1
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This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC. 49 pages. Released June 2013.

IPC J-STD-004 - Requirements for Soldering Fluxes - includes Amendment 1
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This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. 20 pages. Released November 2011.

IPC J-STD-005 - Requirements for Soldering Pastes
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This standard lists requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. Additional support is provided in IPC-HDBK-005, Guide to Solder Paste Assessment (not included with purchase of this standard). Supersedes J-STD-005. 10 pages. Released February 2012.

IPC J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
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This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon and powder solders for electronic soldering applications; and for ‘‘special’’ electronic grade solders. This is a quality control standard and is not intended to relate directly to the material’s performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials to be used in the electronics industry. The other two standards in this set are IPC/EIA J-STD-004, Requirements for Soldering Fluxes, and IPC/EIA J-STD-005, Requirements for Soldering Pastes

This "C" revision has been updated to address intentional additions to a solder alloy and impurities in the alloy. In addition, the tables and appendices have been updated with the latest alloy information. 22 pages. Released July 2013.

IPC J-STD-020 – IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
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IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies.

IPC/JEDEC J-STD-033 - Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Seisitive Devices
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IPC/JEDEC J-STD-033 provides surface mount device manufacturers and users with standardized methods for handling, packing, shopping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033 procedures provides a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.

IPC J-STD-075 - Classification of Non-IC Electronic Components for Assembly Processes
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J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommend processes for an assembler. It outlines a process to clarify and label non-semiconductor industry's classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033, Handling, Packing, Shipping and Use og Moisture/Sensitive Surface Mount Devices). This standard supersedes IPC-9503. Developed by ECA, IPC and JEDEC. 12 pages. Released August 2008.

IPC-7527 - Requirements for Solder Paste Printing
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This standard is a collection of visual quality acceptability criteria for solder paste printing. It provides a standardized language for solder paste characterization. It provides users with common descriptions and potential causes for solder paste deposits. The standard provides valuable insights to the solder paste printing operations which can be used in troubleshooting of the printing process.


IPC-A-610 – Acceptability of Electronic Assemblies
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IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies through detailed statements reflecting acceptable and defect conditions, supported by full-color photographs and illustrations. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Additionally, wherever possible statements were modified to make readability easier and to enhance understanding — all without eliminating any requirements.

Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements.

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision F has 814 photos and illustrations of acceptability criteria — 86 of them new or updated. The document synchronizes to the requirements expressed in other industry consensus documents and is most often used with the material and process standard IPC J-STD-001. 424 pages. Released July 2014.

IPC/WHMA-A-620 – Godkendelseskrav for kabler og for produkter med wire harness
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Revision B er nu tilgængelig som den eneste industristandard for ”Godkendelseskrav for kabler og produkter med wire harness”. IPC og Wire Harness Manufacturers Association (WHMA) fortsætter samarbejdet med at udvikle denne væsentlige opdatering.

NYT! Inkluderer udvidede kriterier for formstøbning, indstøbning, splejsning, crimpekontakter uden isolationsstøtte, IDC konnektorer, konnektering, rigid og formbare kabler, fleksibelt flex, syning af kabelbundter, test og meget mere!

Denne revision har 682 farvebilleder og illustrationer – hvoraf 125 er ny eller opdaterede. De 19 kapitler omfatter kriterier for klargøring af ledninger, lodning på terminaler, crimpning af stansede og formede kontakter, maskinbearbejdede kontakter, IDC konnektorer, ultralydssvejsning, splejsning, konnektorer, støbning, mærkning, coax/biax kabler, punktbinding og sammenhængende kabelbinding, afskærmning, slutsamling og wire wrap termineringer. 400 sider. Udgivet oktober 2012. Inkluderer Amendment 1, august 2013. Oversat november 2013.


IPC-7711-7721 – Rework, modifikation og reparation af elektronikprodukter (udarbejdelse af dansk oversættelse i gang)
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 This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! IPC-7711B/7721B Rework, Modification and Repair of Electronic Assemblies has received a complete procedure by procedure update to assure applicability to both lead free and traditional SnPb soldered assemblies. This single volume includes all previously published changes and several new procedures for BGAs (including reballing) and flex-print repair. Part 1 General Requirements has also been updated for ease of use and provides important direction and guidelines for all procedures. This section includes procedures common to rework, repair and modification. Part 2 is IPC-7711B and the procedures include tools, materials and methods to be used in removing and replacing surface mount and through-hole components. Part 3 is IPC-7721B and includes procedures for modifying assemblies and accomplishing laminate and conductor repairs. This guide is provided in a three ring binder for easy updating. Users can insert company specific procedures, or remove just the pages needed for a specific job to help keep the workbench clear. Future updates can be downloaded FREE from Many procedures have color illustrations to help the user understand the guide. Supersedes IPC-7711, IPC-7721 and IPC-R-700. Over 300 pages. Released November 2007.

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