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IPC-6012 indhold   ■   Sidst opdateret:    ■   Tænk stort - tænk HYTEK

1 SCOPE

1.1 Statement of Scope
1.2 Purpose
1.2.1 Supporting Documentation
1.3 Performance Classification and Type
1.3.1 Classification
1.3.2 Printed Board Type
1.3.3 Selection for Procurement
1.3.4 Material, Plating Process and Final Finish
1.4 Terms and Definitions
1.4.1 As Agreed Between User and Supplier (AABUS)
1.5 Interpretation
1.6 Presentation
1.7 Revision Level Changes

2 APPLICABLE DOCUMENTS

2.1 IPC
2.2 Joint Industry Standards
2.3 Federal
2.4 Other Publications
2.4.1 American Society for Testing and Materials
2.4.2 Underwriters Lab
2.4.3 National Electrical Manufacturers Association
2.4.4 American Society for Quality
2.4.5 AMS
2.4.6 American Society of Mechanical Engineers

 

3 REQUIREMENTS

3.1 General
3.2 Materials
3.2.1 Laminates and Bonding Material
3.2.2 External Bonding Materials
3.2.3 Other Dielectric Materials
3.2.4 Metal Foils
3.2.5 Metal Planes/Cores
3.2.6 Base Metallic Plating Depositions and Conductive Coatings
3.2.7 Final Finish Depositions and Coatings – Metallic and Nonmetallic
3.2.8 Polymer Coating (Solder Mask)
3.2.9 Fusing Fluids and Fluxes
3.2.10 Marking Inks
3.2.11 Hole Fill Insulation Material
3.2.12 Heatsink Planes, External
3.2.13 Via Protection
3.2.14 Embedded Passive Materials
3.3 Visual Examination
3.3.1 Edges
3.3.2 Laminate Imperfections
3.3.3 Plating and Coating Voids in the Hole
3.3.4 Lifted Lands
3.3.5 Marking
3.3.6 Solderability
3.3.7 Plating Adhesion
3.3.8 Edge Printed Board Contact, Junction of Gold Plate to Solder Finish
3.3.9 Workmanship
3.4 Printed Board Dimensional Requirements
3.4.1 Hole Size, Hole Pattern Accuracy and Pattern Feature Accuracy
3.4.2 Annular Ring and Breakout (External)
3.4.3 Bow and Twist
3.5 Conductor Definition
3.5.1 Conductor Width and Thickness
3.5.2 Conductor Spacing
3.5.3 Conductor Imperfections
3.5.4 Conductive Surfaces
3.6 Structural Integrity

3.6.1 Thermal Stress Testing
3.6.2 Requirements for Microsectioned Coupons or Printed Boards
3.7 Solder Mask Requirements
3.7.1 Solder Mask Coverage
3.7.2 Solder Mask Cure and Adhesion
3.7.3 Solder Mask Thickness
3.8 Electrical Requirements
3.8.1 Dielectric Withstanding Voltage
3.8.2 Electrical Continuity and Isolation Resistance
3.8.3 Circuit/PTH Shorts to Metal Substrate
3.8.4 Moisture and Insulation Resistance (MIR)
3.9 Cleanliness
3.9.1 Cleanliness Prior to Solder Mask Application
3.9.2 Cleanliness After Solder Mask, Solder, or Alternative Surface Coating Application
3.9.3 Cleanliness of Inner Layers After Oxide Treatment Prior to Lamination
3.10 Special Requirements
3.10.1 Outgassing
3.10.2 Organic Contamination
3.10.3 Fungus Resistance
3.10.4 Vibration
3.10.5 Mechanical Shock
3.10.6 Impedance Testing
3.10.7 Coefficient of Thermal Expansion (CTE)
3.10.8 Thermal Shock
3.10.9 Surface Insulation Resistance (As Received)
3.10.10 Metal Core (Horizontal Microsection)
3.10.11 Rework Simulation
3.10.12 Bond Strength, Unsupported Component Hole Land
3.10.13 Destructive Physical Analysis
3.11 Repair
3.11.1 Circuit Repairs
3.12 Rework
3.6.1 Thermal Stress Testing

 

4 QUALITY ASSURANCE PROVISIONS

4.1 General
4.1.1 Qualification
4.1.2 Sample Test Coupons
4.2 Acceptance Tests
4.2.1 C=0 Zero Acceptance Number Sampling Plan
4.2.2 Referee Tests
4.3 Quality Conformance Testing
4.3.1 Coupon Selection

5 NOTES

5.1 Ordering Data
5.2 Superseded Specifications

APPENDIX A

APPENDIX B
 
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